Engineering Day to draw more than 1,200 students from region to college campus

NEW PALTZ — The School of Science and Engineering at the State University of New York at New Paltz will host the sixth annual New Faces of Engineering Day beginning at 9 a.m. on Wednesday, Feb. 20. The daylong event is designed to excite middle school and high school students about engineering, science and technology and to spur their interest in pursuing careers in these fields.

Approximately 1,200 students from the Hudson River Valley region will visit trade show displays of state-of-the-art products designed by professional engineers from more than 40 high-tech companies. Many of these exhibits will enable the students to get hands-on involvement in engineering activities.

The keynote speaker will be Dr. Wendy Arienzo, vice president of manufacturing technologies at NXP Semiconductors in Fishkill. Arienzo is responsible for all aspects of manufacturing semiconductor integrated circuits and associated research and development activities. The semiconductors manufactured in the Fishkill facility are used by people all over the world in products ranging from mobile phones, digital televisions and television remotes, and "smart" credit cards that ensure security and authentication of information.

Arienzo has received two U.S. patents and is the author of 20 published papers.

Sponsors of the event include: NXP Semiconductors; 3Xi Consuting; Campus Auxiliary Services; Central Hudson; The Chazen Companies; DEPCO/FESTO; Fair Rite Products; Fala Technologies; Heslin, Rothenberg, Farley & Mesiti PC; Hudson Valley Technology Development Center; IBM; Lemberger Ventures; New York Power Authority; NYSERDA; Panasonic Displays; SEMATECH; SP Industries; and Zierick Technologies.

This event is organized by the university’s Engineering Advisory Board with the cooperation of other university departments and local and regional businesses.

For more information about the School of Science and Engineering at SUNY New Paltz, visit